Shinko Electric Industries

State-backed Japan Investment Corp (JIC) will join Dai Nippon Printing and Mitsui Chemicals to buy out Shinko Electric Industries, a chip-packaging unit of Fujitsu, for 684.9 billion yen ($4.71 billion).

Mitsubishi Corp is considering bidding for Fujitsu's chip packaging unit Shinko Electric Industries, as it explores entry into semiconductor manufacturing. The bid is under consideration and not yet confirmed.

Shinko Electric Industries will invest 53.3 billion yen to construct a new building at its plant in Chikuma, Nagano, for mass production of next-generation semiconductor packages, with operations starting July 2029.

Shinko Electric Industries will invest JPY 28 billion to build a new building at its Arai Plant in Myoko City, Niigata Prefecture, to double production capacity of plastic BGA substrates for semiconductor memory. The new line is expected to start operation in 2023.

Shinko Electric Industries announced on May 19, 2022, that its new plant in Chikuma, Nagano Prefecture, will start operations in the second half of fiscal year 2024. The plant will produce flip-chip packages for semiconductors, with investment of 140 billion yen for 2022-2025, increasing capacity by 50%.

Shinko Electric Industries will build a new building at its Takadai plant in Nakano City to double production capacity of ceramic electrostatic chucks, a key component for semiconductor manufacturing equipment. Construction starts December 2021, with operations beginning in 2023.

Shinko Electric Industries will build a new production facility in Chikuma City, Nagano Prefecture, to increase flip-chip package production capacity by about 50%. Investment is ¥140 billion, with construction starting in 2022 and operations beginning in fiscal 2024.

Shinko Electric Industries announced a JPY 158 billion capital investment plan through FY2025 to build a new plant in Chikuma, Nagano, and expand existing facilities, increasing flip-chip package capacity by 50% and doubling ceramic electrostatic chuck capacity.

Shinko Electric Industries plans to invest 54 billion yen over four years (FY2018-2021) to increase flip-chip substrate production capacity by about 40%.

Shinko Electric Industries will invest 1.6 billion yen in fiscal 2019 to build a next-generation plastic BGA substrate manufacturing line at its Arai Plant in Myoko, Niigata, Japan. The line will use advanced MSAP technology and is expected to start operation in the second half of fiscal 2019.