The Tianjin government is in early discussions to sell stakes in Tianjin Zhonghuan Semiconductor and Tianjin Printronics Circuit to TCL, either through direct stake sales or by acquiring control of the major shareholder.
Tianjin Zhonghuan Semiconductor signed an agreement with Hohhot government to invest 9 billion yuan ($1.34 billion) in a monocrystalline silicon program with 25 GW annual wafer capacity. Construction starts mid-April 2019, operations expected October 2021.
Tianjin Zhonghuan Semiconductor, Gree Electric Appliances, Changan Automobile, CSR Research Institute, CRRC Times Electric, Xiangtou Holdings, CRRC Electric, and CRRC New Materials jointly established Hunan Power Semiconductor Innovation Center with registered capital of CNY 500 million.
Tianjin Zhonghuan Semiconductor Co. and Zhejiang Jingsheng Mechanical & Electrical Co. signed an agreement with the Wuxi government to build an integrated circuit silicon wafer production base worth about USD 3 billion, with first-phase investment of USD 1.5 billion.
| Site | Largest | Latest |
|---|---|---|
| Hohhot, China | $1.34B | 2019-03-19 |
| Wuxi, China | $3.00B | 2017-10-14 |