Tianjin Zhonghuan Semiconductor plans $1.34B silicon wafer plant in Hohhot

Tianjin Zhonghuan Semiconductor signed an agreement with Hohhot government to invest 9 billion yuan ($1.34 billion) in a monocrystalline silicon program with 25 GW annual wafer capacity. Construction starts mid-April 2019, operations expected October 2021.

“The program, which is set to receive a total investment of 9 billion yuan ($1.34 billion), will target an annual wafer production capacity of 25 gigawatts (GW).”chinaservicesinfo.com

• 1 source
• chinaservicesinfo.comMonocrystalline silicon program planned for Hohhot | www.chinaservicesinfo.comMar 20, 2019

Summarized from public sources; check the original articles before acting on it.