Samsung Electronics is preparing brownfield land at its Giheung campus for an estimated $18.7 billion advanced foundry fab to manufacture 2nm and 4nm logic chips. Initial construction work has begun under a framework contract with Samsung E&A, with structural handover scheduled for December 31, 2028.

Infineon Technologies introduced the AURIX RC1 MCU platform, its first leveraging RISC-V. Samples will be available in the first half of 2027.

Edwards Vacuum opened a $319 million New York expansion for semiconductor supply chains.

Tonbo Imaging India Limited announced plans to invest in a High-Power Microwave testing facility on 130 acres at Mulwada in Vijayapura district, Karnataka, and a manufacturing facility in Bengaluru's ITIR area.

Vertiv and Infineon Technologies signed a three-year strategic agreement for the supply of silicon and silicon carbide power semiconductors. The deal supports Vertiv's production scaling for critical digital infrastructure, including 800 VDC power systems.

SK hynix's plan to invest $45 billion in a semiconductor factory in New York via its subsidiary Solidigm is stalled because the U.S. Department of Commerce is withholding export licenses for equipment to SK hynix's Dalian factory in China. Solidigm is exploring alternative sites.

The U.S. government has delayed export approval for American-made semiconductor manufacturing equipment needed for SK Hynix's factory expansion in Dalian, China. The delay impacts SK Hynix's plans to invest approximately $45 billion in two NAND flash production plants in Marcy, New York, as the company needs revenue from the China expansion to fund the U.S. investment.

V-One Tech subsidiary Syscon Robotics signed a contract worth approximately 3.4 billion won with an unnamed semiconductor components and materials company to supply a Machine Tending Robot System for automating semiconductor material processing. The system combines AMRs with robotic arms and AI vision.

Yunnan Xinyao Semiconductor Materials, a controlling subsidiary of Yunnan Germanium, signed a five-year long-term supply agreement with Applied Optoelectronics (AOI) to supply 180,000 4-inch N-type indium phosphide substrates per year from 2027 to 2031, totaling about 900,000 wafers. The 2027 contract is valued at approximately USD 194 million.

The US Commerce Department has not approved export licences for American chipmaking equipment that SK Hynix wants for its plant in Dalian, China, affecting the company's proposed investment in new NAND memory plants in New York.

Analog Devices, Inc. announced the completion of its acquisition of Alif Semiconductor, an AI-native microcontroller and fusion processor company. The deal expands ADI's total addressable market in industrial, data center, defense, energy, robotics, and other applications.

Chinese automotive technology supplier ECARX signed a non-binding memorandum of understanding with Arm to explore next-generation high-performance AI computing platforms for mobility and other industries.

AIBotics, Inc. entered into a definitive agreement to acquire Empulser Enterprises LLC. The consideration includes up to $22 million in shares, with 90% tied to milestones over 36 months.

Yunnan Chihong's subsidiary Yunnan Xin Yao Semiconductor Materials signed a long-term supply agreement with Applied Optoelectronics (AOI) for 4-inch N-type indium phosphide substrates, with AOI expected to purchase 180,000 pieces annually from 2027 to 2031, totaling 900,000 pieces.

Panasonic Industry will invest about JPY 92 billion to expand production of MEGTRON multilayer circuit board materials in Suzhou, China and Ayutthaya, Thailand, expand SP-Cap capacitor production in Uji, Japan and Batam, Indonesia, and build a new R&D centre for semiconductor packaging materials in Yokkaichi, Japan.

The Department of Defense issued a conditional loan of up to $450 million to Neros, and the company pledged $165 million in equity, for a total of $615 million to expand its manufacturing facility in Torrance, California. The expansion aims to increase production capacity to 1 million drones per year by 2028.

AUMOVIO received series-production awards worth over €500 million for its third-generation satellite cameras from a leading Chinese vehicle manufacturer and one of Asia's largest vehicle manufacturers. Production is planned to start in Q4 2027.

Samsung Electronics will formally start construction of its second foundry plant in Taylor, Texas, in November 2026. The plant will produce base dies for HBM chips for AMD and Nvidia using 2nm technology, with mass production targeted for 2030.

Estek Automation Sdn. Bhd. officially opened a new 50,000-square-foot manufacturing facility in Batu Kawan, Penang, representing a total investment of MYR 20 million ($4.91 million). The facility will focus on semiconductor equipment manufacturing and AI solutions.

Techwing announced a 52.6 billion won investment to build a new factory at the Cheonan BIT Industrial Complex in Cheonan, South Korea, to expand semiconductor equipment production capacity. The investment period runs from November 3, 2026 to July 31, 2027.

Simmtech announced a 105.4 billion won investment to expand production, logistics and office facilities at its Cheongju 2 site in Cheongju, South Korea, to meet rising semiconductor demand. The investment runs from November 3, 2026 to August 31, 2028.

Kaynes Semicon signed an MoU with the Haryana Enterprises Promotion Centre to invest approximately ₹500 crore in establishing a state-of-the-art semiconductor manufacturing facility in Haryana, India. The facility is expected to create around 1,000 jobs.

Samsung Electronics' foundry division is expected to produce a U.S. cloud company's AI chip on the 2nm GAA node through Taiwan-based design partner Faraday. Faraday won the ASIC design project, its largest since founding, with first revenue expected in the first half of 2027.

Samsung Austin Semiconductor's Fab 1 at its Taylor, Texas campus, with an initial minimum investment of $17 billion, is on track to be operational by the end of 2026. The 1,200-acre campus includes a six-floor office building and cleanroom the size of six football fields.

BASF has signed an investment agreement with Nanjing Jiangbei New Area to establish a new electronic materials production site in Nanjing, China, to support the semiconductor industry. The facility is expected to start up by the end of 2028.

CATL partnered with Chinese eVTOL developer Blue Vector Intelligent Technology to develop a customized aviation battery for the SKYLA V30 electric aircraft. CATL will become the exclusive battery supplier.

CMTX is expanding its manufacturing capacity on land adjacent to its existing factory in the Fifth National Industrial Complex in Gumi, South Korea. The expansion is expected to nearly double annual production capacity from 200 billion won to 400 billion won, with new facilities starting operations in stages in 2027.

Isupetasys signed an investment agreement to build a seventh factory at the Daegu National Industrial Complex in Dalseong-gun, investing 500 billion won ($374 million) on a 168,300-square-meter site.

ON Semiconductor (onsemi) agreed to acquire Ferric, Inc. for $600 million in cash at closing plus up to $175 million in revenue-milestone payments. The deal is expected to close by the end of 2026.

onsemi has agreed to acquire Ferric, an innovator in integrated voltage regulator technology, for $600 million in cash plus up to $175 million in contingent consideration. The acquisition aims to strengthen onsemi's power delivery portfolio for AI processors.

Nippon Shokubai acquired Goo Chemical, a Kyoto-based maker of electronic and specialty resins, for ¥20.0bn. The deal completed on November 2, 2026.

Rockwell Automation has added two factories in Chennai, India, taking its manufacturing base in the city to three. The new factory is dedicated to the Cubic line of modular enclosures and electrical panel components, and a semiconductor-focused plant produces power and electrical infrastructure for chip manufacturing.

Omron Corporation agreed to acquire Interlogic, Inc. and its group companies for $675 million (¥104.6 billion) to bolster its physical AI platform. Interlogic makes rugged industrial PCs and has a customer base in the Americas and Europe.

Axcelis Technologies and Veeco Instruments announced that their all-stock merger is now expected to close by the end of the first quarter of 2027, pending regulatory approvals including from China's SAMR.

Airo Group Holdings secured its first US order for drones made by its Danish subsidiary Sky-Watch. An unnamed US government customer ordered the RQ-35 Heidrun and RQ-70 Dainn unmanned aircraft systems. The value was not disclosed.

UK Research and Innovation (UKRI) awarded a $92,000 contract to Etesian Semiconductor Ltd. to manufacture and supply C100 sensors in the CIS Tower Semiconductor process. The tender was published on 2 November 2026.

CoAsia Semi has begun mass-production shipments of semiconductor wafers manufactured using Samsung Electronics' 4nm foundry process. The network switch chips are for high-performance computing, with a total contract value of $175 million through 2029.

MKS Inc. commenced expansion of its Atotech equipment manufacturing site in Guangzhou, China, with a USD 25 million investment. The facility will grow from 20,000 m² to 50,000 m², add 30 machining systems, and create over 300 jobs. Completion expected in Q3 2027.

SECO S.p.A. signed agreements to buy 60% of Qiyang Technology for €9 million plus up to €3 million earnout, and the remaining 45% of Fannal Electronics for €23 million. Both deals are subject to closing conditions.

Marvell Technology, Inc. and Lumentum announced a definitive agreement for Marvell to acquire Lumentum in an all-stock transaction valued at $115 billion enterprise value. The deal combines electrical and optical technologies for AI connectivity. The announcement was made on November 2, 2026.

Samsung Electronics acquired a 10.16% stake in TCL China Star Optoelectronics Technology (TCL CSOT) from Samsung Display. The transaction strengthens strategic collaboration between TCL CSOT and Samsung Electronics.

Nordson acquired a sensor manufacturer with nearly 500 employees, adding inductive, photoelectric and smart measurement sensing technologies.

TDK Corporation announced strategic investments of approximately 100 billion yen to strengthen development and mass-production of TMR magnetic sensors at its TDK Shinano River Techno Factory in Ojiya City, Niigata Prefecture, Japan. The factory was established in June 2026.

Vishay Siliconix Itzehoe received a €215 million grant from German federal and state governments to upgrade its fab from 200mm to 300mm wafers for power MOSFETs, more than doubling capacity. The funding is under the European Chips Act.

Samsung Electro-Mechanics signed a ₩879.3 billion one-year supply contract for multilayer ceramic capacitors (MLCCs) for AI servers with an unnamed global customer. Supply runs from December 2026 to December 2027.

Vishay Intertechnology is expanding its power semiconductor production in Itzehoe, Germany, with a new 300mm wafer fabrication facility. The project is supported by €215 million in subsidies from the German federal and state governments, and will create about 250 jobs.

Edwards Vacuum, part of Atlas Copco Group, opened a 250,000-square-foot facility in Genesee County to expand US production of dry vacuum pumps for the semiconductor industry, expected to employ up to 600 people.

Korean supplier Asflow is building a factory in the Korean Industrial Park in Fenghuang Town, Zhangjiagang, Jiangsu Province, China, with a total investment of $150 million. The first phase covers 23,140 square meters, with completion targeted for January 2027 and mass production expected in Q2 2027.

MKS Instruments (via its Atotech brand) has broken ground on a $25 million expansion of its equipment manufacturing base in Guangzhou's Huangpu District. The project will add about 30,000 sqm of space, doubling capacity, and is expected to be completed by Q4 2027.

Amco Technology Korea increased its planned investment in expanding its Gwangju plant from 1 trillion won to about 3 trillion won and began construction of new high-tech semiconductor manufacturing lines. The expansion is expected to create more than 2,000 jobs.