SDIC Microelectronics mulls acquiring 70% of Chipbond Technology unit

SDIC Microelectronics is considering acquiring up to 70% of a unit of Chipbond Technology for 140 million yuan.

“SDIC Microelectronics Mulls Acquiring Up to 70% of Chipbond Technology's Unit for 140 Million Yuan”marketscreener.com

• 1 source
• marketscreener.comSDIC Microelectronics Mulls Acquiring Up to 70% of Chipbond Technology's Unit for 140 Million Yuan | MarketScreenerMT NewswiresSep 20, 2024

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