Toshiba completes new 300-mm wafer fab for power semiconductors in Japan

Toshiba Electronic Devices & Storage Corporation completed construction of Phase 1 of a new 300-millimeter wafer fabrication facility for power semiconductors at Kaga Toshiba Electronics in Ishikawa Prefecture, Japan. Mass production is expected to start in the second half of fiscal year 2024.

“Toshiba Electronic Devices & Storage Corporation today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation.”za.investing.com

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• za.investing.comToshiba Completes New 300-Millimeter Wafer Fabrication Facility for Power Semiconductors By Investing.comMay 23, 2024

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