Toshiba to build 300mm wafer fab for power devices in Nomi, Japan

Toshiba Electronic Devices & Storage Corporation will construct a 300-millimeter wafer fabrication facility at Kaga Toshiba Electronics Corporation in Nomi, Ishikawa Prefecture, Japan, to expand production capacity for power devices. Mass production is expected to start in the first half of fiscal year 2023.

“Toshiba will expand production capacity for power devices with the construction of a 300-millimeter wafer fabrication facility at Kaga Toshiba Electronics Corporation in Japan.”toshiba.semicon-storage.com

• 2 sources
• toshiba.semicon-storage.comToshiba Electronic Devices & Storage Corporation Announces Major Investment in Power Devices Business | Toshiba Electronic Devices & Storage Corporation | Asia-EnglishMar 1, 2021
• toshiba.semicon-storage.comToshiba Electronic Devices & Storage Corporation Announces Major Investment in Power Devices Business | Toshiba Electronic Devices & Storage Corporation | Americas – United StatesMar 10, 2021

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