Loading…

ENDATA · Copyright (c) 2026 Endata · Data: CEPII BACI (Etalab 2.0), Federal Reserve G.17, U.S. BLS, Eurostat, World Bank (CC BY 4.0), GLEIF, SEC EDGAR; announcements summarized from the linked sourcesProspects Companies Sectors Announcements Countries

HOME BRIEF PROSPECTS SECTORS ANNOUNCEMENTS COMPANIES COUNTRIES

>

INDUSTRIAL MARKET INTELLIGENCE

ANNOUNCEMENTSAll New facility Expansion Investment Acquisition Contract Closure

INDUSTRIAL MACHINERY273.5▲ +4.87%AUTOMATION AND ROBOTICS348.5▲ +10.05%PUMPS AND VALVES401.5▲ +2.64%MATERIAL HANDLING340.7▲ +3.73%FOOD PROCESSING EQUIPMENT394.8▲ +4.07%STEEL AND METAL PRODUCTS344.9▲ +29.04%SPECIALTY CHEMICALS256.3▲ +5.14%PLASTICS AND POLYMERS327.5▲ +5.94%PACKAGING506.1▲ +8.86%INDUSTRIAL TEXTILES185.9▲ +3.45%ELECTRICAL EQUIPMENT256.3▲ +8.77%SEMICONDUCTORS AND INDUSTRIAL ELECTRONICS75.3▲ +26.02%AUTOMOTIVE COMPONENTS134.7▲ +3.13%AEROSPACE COMPONENTS291.0▲ +2.38%MEDICAL DEVICES146.2▲ +4.99%CONSTRUCTION MATERIALS262.9▲ +4.08%HVAC AND INDUSTRIAL REFRIGERATION243.3▲ +5.55%POWER GENERATION EQUIPMENT289.6▲ +3.63%WATER TREATMENT EQUIPMENT152.1▲ +2.68%MINING EQUIPMENT462.3▲ +3.56%INDUSTRIAL MACHINERY273.5▲ +4.87%AUTOMATION AND ROBOTICS348.5▲ +10.05%PUMPS AND VALVES401.5▲ +2.64%MATERIAL HANDLING340.7▲ +3.73%FOOD PROCESSING EQUIPMENT394.8▲ +4.07%STEEL AND METAL PRODUCTS344.9▲ +29.04%SPECIALTY CHEMICALS256.3▲ +5.14%PLASTICS AND POLYMERS327.5▲ +5.94%PACKAGING506.1▲ +8.86%INDUSTRIAL TEXTILES185.9▲ +3.45%ELECTRICAL EQUIPMENT256.3▲ +8.77%SEMICONDUCTORS AND INDUSTRIAL ELECTRONICS75.3▲ +26.02%AUTOMOTIVE COMPONENTS134.7▲ +3.13%AEROSPACE COMPONENTS291.0▲ +2.38%MEDICAL DEVICES146.2▲ +4.99%CONSTRUCTION MATERIALS262.9▲ +4.08%HVAC AND INDUSTRIAL REFRIGERATION243.3▲ +5.55%POWER GENERATION EQUIPMENT289.6▲ +3.63%WATER TREATMENT EQUIPMENT152.1▲ +2.68%MINING EQUIPMENT462.3▲ +3.56%

Rohm to build SiC power semiconductor plant in Miyazaki, Japan · Endata

◂ Announcements

Jul 12, 2023NEW FACILITYKunitomi, Miyazaki Prefecture, Japan, Japan

Rohm to build SiC power semiconductor plant in Miyazaki, Japan

Rohm announced it will build a new SiC power semiconductor factory in Miyazaki Prefecture, Japan, by acquiring land and buildings from Solar Frontier. The plant will use 8-inch wafers and aims to start operations by end of 2024.

Starts operating

Dec 2024

Status

Announced

ProductsSiC power semiconductors

CompaniesRÖHM Group Solar Frontier partner

Sectors#Semiconductors and Industrial Electronics

“ロームは12日、EV（電気自動車）市場の拡大などにより需要が伸びているパワー半導体の新工場を宮崎県に建設すると発表した。”nikkei.com

1 source
nikkei.comローム、宮崎にパワー半導体工場建設へ SiC増産急ぐ - 日本経済新聞Nikkei Inc.Jul 12, 2023

Summarized from public sources; check the original articles before acting on it.

More from RÖHM Group

Sep 30, 2024PARTNERSHIPJapan
DENSO and ROHM agree to consider strategic partnership in semiconductors
DENSO partner RÖHM Group partner denso.com acnnewswire.com
Sep 6, 2024PARTNERSHIP
Sabic and Röhm merge business divisions to form Polyvantis
POLYVANTIS SABIC partner en.kunststoffe.de
Aug 28, 2024CONTRACTChina
ROHM and UAES sign long-term supply agreement for SiC power devices
RÖHM Group RÖHM Group supplier powersemiconductorsweekly.com autotechinsight.spglobal.com semiconductor-digest.com
Jul 8, 2024INVESTMENTJapan$31.0Bops 2029
Eight Japanese firms plan JPY 5 trillion semiconductor investment
Sony Mitsubishi Electric trendforce.com
Jul 8, 2024EXPANSIONNuremberg, Germany, Germanyops 2027
SiCrystal to triple SiC wafer production capacity in Nuremberg
SiCrystal RÖHM Group partner eenewseurope.com
Jun 10, 2024EXPANSIONWallingford, Connecticut, United Statesops Jun 2024
Röhm expands specialty molding compounds capacity at Wallingford plant
RÖHM Group roehm.com

Similar announcements

Oct 30, 2026NEW FACILITYBuzen, Fukuoka Prefecture, Japan$400.0Mops Q2 2029
TOTO to invest ¥60 billion in new semiconductor ceramics factory in Buzen, Japan
TOTO japan.co.jp
Nov 20, 2024NEW FACILITYFukuoka Prefecture, Japan, Japan$67.0Mops Oct 2026
Mitsubishi Electric to construct new power module assembly plant in Fukuoka
Mitsubishi Electric mitsubishielectric.com
Nov 5, 2026NEW FACILITYOnyang, Asan, South Chungcheong Province, South Korea, South Korea$975.0Mops May 2029
Samsung Electronics to build HBM packaging fab in Onyang, South Korea
Samsung Electronics mt.co.kr
Nov 5, 2026EXPANSIONIbaraki Office, Hitachi area, Japanops Q3 2027
JX Advanced Metals to expand high-purity copper sulfate production in Hitachi
JX Advanced Metals Corporation jx-nmm.com
Nov 4, 2026NEW FACILITYOchang, Cheongju, North Chungcheong Province, South Korea$31.6M123 jobsops Jun 2024
Greene Tweed builds $31.6M chip seal plant in Ochang, South Korea
Greene Tweed eastasiabrief.com
Nov 4, 2026NEW FACILITYBengaluru and Vijayapura district, Karnataka, India
Tonbo Imaging seeks land for HPM manufacturing and testing facilities in Karnataka
Tonbo Imaging thehindubusinessline.com