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SK hynix to build $3.9B advanced packaging facility in West Lafayette, Indiana · Endata

◂ Announcements

Jul 17, 2022NEW FACILITYWest Lafayette, Indiana, United States

SK hynix to build $3.9B advanced packaging facility in West Lafayette, Indiana

SK hynix announced plans to invest almost $3.9 billion to build an advanced packaging facility for AI products and an R&D facility at Purdue University in West Lafayette, Indiana. Production is expected to begin in late 2028.

Value

$3.90B

Starts operating

Q4 2028

Status

Announced

Productsadvanced chip packaging for AI

CompaniesSK Hynix

Sectors#Semiconductors and Industrial Electronics

“SK hynix (SK) (www.skhynix.com), a South Korean manufacturer of High Bandwidth Memory (HBM) chips announced they were investing almost $3.9 billion to build an advanced packaging facility for AI (Artificial Intelligence) products and an R&D facility at Purdue University, West Lafayette Indiana.”uspublicworks.com

1 source
uspublicworks.comBillion Dollar Projects - Welcome to US Public Works -Jul 17, 2022

Summarized from public sources; check the original articles before acting on it.

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Nov 4, 2026REGULATIONMarcy, New York, United States$45.0B
U.S. delays export approval for SK Hynix semiconductor equipment for China factory
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Nov 3, 2026EXPANSIONDalian, China, China
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Jul 27, 2022INVESTMENTUnited States$22.0B
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SK디앤디 SK Hynix investor pulse.mk.co.kr
Jun 27, 2022CONTRACTSouth Korea$430K
Widetek signs KRW 5.6B semiconductor equipment supply deal with SK Hynix
SK Hynix customer Widetek supplier fnnews.com
Apr 29, 2022NEW FACILITYYongin, South Korea, South Korea$94.9Bops 2027
SK hynix begins construction of $94.9B Yongin Semiconductor Cluster
SK Hynix investkorea.org

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