Samsung Electro-Mechanics invests 300 billion won in Busan substrate capacity

Samsung Electro-Mechanics invested 300 billion won ($247 million) to expand semiconductor package substrate capacity at its Busan plant, producing FCBGA packages for PCs and servers.

“The funding will be used to produce flip-chip ball grid array (FCBGA) packages, a sophisticated type of chip substrate designed to bind together high-performing processors and protect them from the surrounding environment.”koreajoongangdaily.com

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• koreajoongangdaily.comSamsung Electro-Mechanics invests in capacity expansionPARK EUN-JEEMar 21, 2022

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