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Shengdie Semiconductor (Shanghai), a subsidiary of Western Digital, will start construction of a third-phase expansion in July 2020. The project involves about 11,800 square meters of production and support space, with total investment of about 1 billion yuan (approx. $141 million), to support next-generation BiCS4 and BiCS5 flash memory products.
“晟碟半导体扩建工程是闵行区重大项目,目前已经完成了控规调整、发改委备案、方案审批、施工图审批等工作,正在办理土地补充协议和施工许可证,即将按原定计划7月份开工。”semiw.com
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