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TSMC announced plans to build and operate an advanced semiconductor fab in Arizona, USA, with 5-nanometer technology, 20,000 wafers per month capacity, and over 1,600 direct jobs. Construction is planned to start in 2021 with production targeted to begin in 2024, with total spending of approximately US$12 billion from 2021 to 2029.
“TSMC today announced its intention to build and operate an advanced semiconductor fab in the United States with the mutual understanding and commitment to support from the U.S. federal government and the State of Arizona.”telecoms.com
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