Loading…

ENDATA · Copyright (c) 2026 Endata · Data: CEPII BACI (Etalab 2.0), Federal Reserve G.17, U.S. BLS, Eurostat, World Bank (CC BY 4.0), GLEIF, SEC EDGAR; announcements summarized from the linked sourcesProspects Companies Sectors Announcements Countries

HOME BRIEF PROSPECTS SECTORS ANNOUNCEMENTS COMPANIES COUNTRIES

>

INDUSTRIAL MARKET INTELLIGENCE

ANNOUNCEMENTSAll New facility Expansion Investment Acquisition Contract Closure

INDUSTRIAL MACHINERY273.5▲ +4.87%AUTOMATION AND ROBOTICS348.5▲ +10.05%PUMPS AND VALVES401.5▲ +2.64%MATERIAL HANDLING340.7▲ +3.73%FOOD PROCESSING EQUIPMENT394.8▲ +4.07%STEEL AND METAL PRODUCTS344.9▲ +29.04%SPECIALTY CHEMICALS256.3▲ +5.14%PLASTICS AND POLYMERS327.5▲ +5.94%PACKAGING506.1▲ +8.86%INDUSTRIAL TEXTILES185.9▲ +3.45%ELECTRICAL EQUIPMENT256.3▲ +8.77%SEMICONDUCTORS AND INDUSTRIAL ELECTRONICS75.3▲ +26.02%AUTOMOTIVE COMPONENTS134.7▲ +3.13%AEROSPACE COMPONENTS291.0▲ +2.38%MEDICAL DEVICES146.2▲ +4.99%CONSTRUCTION MATERIALS262.9▲ +4.08%HVAC AND INDUSTRIAL REFRIGERATION243.3▲ +5.55%POWER GENERATION EQUIPMENT289.6▲ +3.63%WATER TREATMENT EQUIPMENT152.1▲ +2.68%MINING EQUIPMENT462.3▲ +3.56%INDUSTRIAL MACHINERY273.5▲ +4.87%AUTOMATION AND ROBOTICS348.5▲ +10.05%PUMPS AND VALVES401.5▲ +2.64%MATERIAL HANDLING340.7▲ +3.73%FOOD PROCESSING EQUIPMENT394.8▲ +4.07%STEEL AND METAL PRODUCTS344.9▲ +29.04%SPECIALTY CHEMICALS256.3▲ +5.14%PLASTICS AND POLYMERS327.5▲ +5.94%PACKAGING506.1▲ +8.86%INDUSTRIAL TEXTILES185.9▲ +3.45%ELECTRICAL EQUIPMENT256.3▲ +8.77%SEMICONDUCTORS AND INDUSTRIAL ELECTRONICS75.3▲ +26.02%AUTOMOTIVE COMPONENTS134.7▲ +3.13%AEROSPACE COMPONENTS291.0▲ +2.38%MEDICAL DEVICES146.2▲ +4.99%CONSTRUCTION MATERIALS262.9▲ +4.08%HVAC AND INDUSTRIAL REFRIGERATION243.3▲ +5.55%POWER GENERATION EQUIPMENT289.6▲ +3.63%WATER TREATMENT EQUIPMENT152.1▲ +2.68%MINING EQUIPMENT462.3▲ +3.56%

Infineon breaks ground on HUF 32 billion plant in Cegled, Hungary · Endata

◂ Announcements

Sep 30, 2019NEW FACILITYCegled, Hungary, Hungary

Infineon breaks ground on HUF 32 billion plant in Cegled, Hungary

Infineon Technologies laid the cornerstone for a new semiconductor facility in Cegled, Hungary. The HUF 32 billion investment will create 275 jobs and production is expected to start at the end of 2021.

Value

$106.0M (32.0B HUF)

Jobs

275

Starts operating

2021

Status

Under construction

Productssemiconductors

CompaniesInfineon Technologies AG

Sectors#Semiconductors and Industrial Electronics

“Infineon Technologies inaugurated the start of the construction of its new facility in Cegled, Hungary, on 30 September.”telecompaper.com

1 source
telecompaper.comInfineon lays cornerstone of new plant in Hungary - TelecompaperOct 2, 2019

Summarized from public sources; check the original articles before acting on it.

More from Infineon Technologies AG

Nov 4, 2026PRODUCT LAUNCHGermany
Infineon introduces new automotive microcontroller platform AURIX RC1
Infineon Technologies AG marklines.com
Nov 4, 2026PARTNERSHIP
Vertiv and Infineon sign three-year strategic agreement for power semiconductors
Vertiv Infineon Technologies AG partner vertiv.com
Oct 22, 2019ACQUISITION$9.90B
Infineon to acquire Cypress Semiconductor for EUR 9 billion
Infineon Technologies AG acquirer Cypress Semiconductor target evertiq.com
Aug 8, 2019ACQUISITIONUnited States$10.0B
Infineon to acquire Cypress Semiconductor for $10B
Infineon Technologies AG acquirer Cypress Semiconductor target thefreelibrary.com streetinsider.com manilastandard.net
Jun 3, 2019ACQUISITIONSan Jose, California, United States$10.1B
Infineon to acquire Cypress Semiconductor for €9 billion
Infineon Technologies AG acquirer Cypress Semiconductor target en.xfafinance.com bizjournals.com electronicsweekly.com
Jun 2, 2019ACQUISITIONUnited States$10.1B
Infineon to acquire Cypress Semiconductor for €9.0 billion
Infineon Technologies AG acquirer Cypress Semiconductor target sec.gov audioxpress.com wsj.com

Similar announcements

Nov 5, 2026NEW FACILITYOnyang, Asan, South Chungcheong Province, South Korea, South Korea$975.0Mops May 2029
Samsung Electronics to build HBM packaging fab in Onyang, South Korea
Samsung Electronics mt.co.kr
Nov 4, 2026NEW FACILITYOchang, Cheongju, North Chungcheong Province, South Korea$31.6M123 jobsops Jun 2024
Greene Tweed builds $31.6M chip seal plant in Ochang, South Korea
Greene Tweed eastasiabrief.com
Nov 4, 2026NEW FACILITYBengaluru and Vijayapura district, Karnataka, India
Tonbo Imaging seeks land for HPM manufacturing and testing facilities in Karnataka
Tonbo Imaging thehindubusinessline.com
Nov 4, 2026NEW FACILITYShenzhen, Nanshan district, Chinaops 4 Nov 2026
RoboSense opens automated digital LiDAR line with 500,000-unit capacity
RoboSense autonews.gasgoo.com
Nov 4, 2026NEW FACILITYGiheung, South Korea, South Korea$18.7B
Samsung Electronics plans $18.7B advanced foundry fab in Giheung
Samsung Electronics Samsung E&A partner eastasiabrief.com
Nov 3, 2026NEW FACILITYTainan, TWNops 2027
Taiwan plans large science park in Tainan for 1nm wafer fab
National Science and Technology Council eet-china.com