Advanced Semiconductor Manufacturing signs wafer foundry agreement with Shanghai Belling

Advanced Semiconductor Manufacturing Corporation (ASMC) signed a new framework foundry agreement with Shanghai Belling to produce 5, 6, and 8-inch semiconductor wafers. The agreement runs from November 8, 2018 to November 7, 2019, with an annual cap of 34 million yuan.

“公司(作为供应商)与上海贝岭(作为买方)签订一份新框架代工协议，自2018年11月8日至2019年11月7日止，为期一年。”zhitongcaijing.com

• 1 source
• zhitongcaijing.com先进半导体(03355)与上海贝岭签订半导体晶圆代工协议 年度上限不超3400万元Nov 8, 2018

Summarized from public sources; check the original articles before acting on it.