CanSemi Technology breaks ground on 300mm wafer fab in China

CanSemi Technology broke ground on a 300mm wafer fab in December 2017 with 7 billion yuan (about $1 billion) investment. The fab will make chips using 0.18-micron to 0.13-micron processes, with first wafers expected in 2019 and capacity of 40,000 wafer starts per month.

“CanSemi Technology Inc. broke ground on its 300mm wafer fab on December 26, 2017 and claims to have 7 billion yuan (about US$1 billion) of investment available.”eenewseurope.com

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• eenewseurope.comIDM or foundry? Chinese startup announces 300mm fab build ...Aug 8, 2018

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