Hua Hong Semiconductor starts piling for $10B Wuxi fab

Hua Hong Group started the piling works for the first phase of its Hua Hong Semiconductor (Wuxi) integrated circuit R&D and manufacturing base. The total investment is $10 billion, with Phase 1 costing about $2.5 billion to build a 12-inch wafer line with 90-65nm process technology and 40,000 wafers per month capacity.

“华虹无锡集成电路研发和制造基地项目占地约 700 亩，总投资 100 亿美元，一期项目总投资约 25 亿美元，新建一条工艺等级 90-65 纳米、月产能约 4 万片的 12 英寸特色工艺集成电路生产线。”chinastor.cn

• 2 sources
• chinastor.cn总投资100亿美元！华虹半导体(无锡)一期桩基工程正式启动-存储器/芯片-中国存储网中国存储网Apr 4, 2018
• beta.zhitongcaijing.com港股异动︱华虹半导体(01347)涨6% 无锡新工厂将成为长期增长的驱动力May 10, 2018

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