Jun 25, 2018NEW FACILITYDresden, Saxony, Germany Bosch invests €1B in new wafer fab in Dresden, Germany
Bosch has laid the foundation stone for a new 300-millimeter wafer fab in Dresden, Germany, with an investment of roughly €1 billion. The plant will employ up to 700 people and is scheduled to be completed by late 2019, with production starting in early 2020.
Capacity
300-millimeter wafers
Productssemiconductors300-millimeter wafers
“Now here we are, following a complex planning process, laying the foundation stone for Bosch's chip factory of the future.”bosch-presse.de
- 8 sources
- bosch-presse.deBosch Media Service Start Page - Bosch Media ServiceJun 25, 2018
- bosch-presse.deBosch Media Service Start Page - Bosch Media ServiceJun 25, 2018
- us.bosch-press.comBosch Media Service Start Page - Bosch Media ServiceJun 25, 2018
- bosch-presse.deBosch lays foundation stone for factory of the future - Bosch Media ServiceJun 25, 2018
- bosch-presse.deGermany, high-tech hub: Semiconductors pave the way for better quality of life. - Bosch Media ServiceJun 25, 2018
- webwire.com
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