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ENDATA · Copyright (c) 2026 Endata · Data: CEPII BACI (Etalab 2.0), Federal Reserve G.17, U.S. BLS, Eurostat, World Bank (CC BY 4.0), GLEIF, SEC EDGAR; announcements summarized from the linked sourcesProspects Companies Sectors Announcements Countries

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ESMC joint venture to build €10B+ fab in Dresden · Endata

◂ Announcements

Semiconductors and Industrial Electronicsworld trade 2024+6.8% 5Y CAGR

Apr 5, 2026NEW FACILITYDresden, Germany

ESMC joint venture to build €10B+ fab in Dresden

The European Semiconductor Manufacturing Company (ESMC) joint venture of TSMC, Bosch, Infineon, and NXP is building a new fab in Dresden costing over €10 billion, with half subsidized by the EU Chips Act.

Value

$11.0B (10.0B EUR)

Status

Announced

Productssemiconductor chips

CompaniesBosch partner Infineon Technologies AG partner TSMC partner NXP Semiconductors partner

Sectors#Semiconductors and Industrial Electronics

“the new fab is slated to cost over €10 billion, with half subsidized by the EU Chips Act.”arveum.com

1 source
arveum.comSemicon Briefing — Arveum Capital PartnersApr 5, 2026

Summarized from public sources; check the original articles before acting on it.

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