Loading…

ENDATA · Copyright (c) 2026 Endata · Data: CEPII BACI (Etalab 2.0), Federal Reserve G.17, U.S. BLS, Eurostat, World Bank (CC BY 4.0), GLEIF, SEC EDGAR; announcements summarized from the linked sourcesProspects Companies Sectors Announcements Countries

HOME BRIEF PROSPECTS SECTORS ANNOUNCEMENTS COMPANIES COUNTRIES

>

INDUSTRIAL MARKET INTELLIGENCE

ANNOUNCEMENTSAll New facility Expansion Investment Acquisition Contract Closure

INDUSTRIAL MACHINERY273.5▲ +4.87%AUTOMATION AND ROBOTICS348.5▲ +10.05%PUMPS AND VALVES401.5▲ +2.64%MATERIAL HANDLING340.7▲ +3.73%FOOD PROCESSING EQUIPMENT394.8▲ +4.07%STEEL AND METAL PRODUCTS344.9▲ +29.04%SPECIALTY CHEMICALS256.3▲ +5.14%PLASTICS AND POLYMERS327.5▲ +5.94%PACKAGING506.1▲ +8.86%INDUSTRIAL TEXTILES185.9▲ +3.45%ELECTRICAL EQUIPMENT256.3▲ +8.77%SEMICONDUCTORS AND INDUSTRIAL ELECTRONICS75.3▲ +26.02%AUTOMOTIVE COMPONENTS134.7▲ +3.13%AEROSPACE COMPONENTS291.0▲ +2.38%MEDICAL DEVICES146.2▲ +4.99%CONSTRUCTION MATERIALS262.9▲ +4.08%HVAC AND INDUSTRIAL REFRIGERATION243.3▲ +5.55%POWER GENERATION EQUIPMENT289.6▲ +3.63%WATER TREATMENT EQUIPMENT152.1▲ +2.68%MINING EQUIPMENT462.3▲ +3.56%INDUSTRIAL MACHINERY273.5▲ +4.87%AUTOMATION AND ROBOTICS348.5▲ +10.05%PUMPS AND VALVES401.5▲ +2.64%MATERIAL HANDLING340.7▲ +3.73%FOOD PROCESSING EQUIPMENT394.8▲ +4.07%STEEL AND METAL PRODUCTS344.9▲ +29.04%SPECIALTY CHEMICALS256.3▲ +5.14%PLASTICS AND POLYMERS327.5▲ +5.94%PACKAGING506.1▲ +8.86%INDUSTRIAL TEXTILES185.9▲ +3.45%ELECTRICAL EQUIPMENT256.3▲ +8.77%SEMICONDUCTORS AND INDUSTRIAL ELECTRONICS75.3▲ +26.02%AUTOMOTIVE COMPONENTS134.7▲ +3.13%AEROSPACE COMPONENTS291.0▲ +2.38%MEDICAL DEVICES146.2▲ +4.99%CONSTRUCTION MATERIALS262.9▲ +4.08%HVAC AND INDUSTRIAL REFRIGERATION243.3▲ +5.55%POWER GENERATION EQUIPMENT289.6▲ +3.63%WATER TREATMENT EQUIPMENT152.1▲ +2.68%MINING EQUIPMENT462.3▲ +3.56%

SK Hynix to build $12.9bn semiconductor packaging plant in Cheongju · Endata

◂ Announcements

Jan 13, 2026NEW FACILITYCheongju, North Chungcheong Province, South Korea

SK Hynix to build $12.9bn semiconductor packaging plant in Cheongju

SK Hynix plans to invest KRW 19 trillion ($12.9 billion) in a new semiconductor packaging facility called P&T7 in Cheongju, South Korea. Construction will start in April 2026 and is targeted for completion by the end of 2027. The plant will focus on advanced packaging for HBM chips used in AI applications.

Value

$12.9B (19000.0B KRW)

Starts operating

2027

Status

Announced

Productshigh-bandwidth memory (HBM) chipsadvanced packaging

CompaniesSK Hynix

Sectors#Semiconductors and Industrial Electronics

“SK Hynix has announced plans to invest Won19tn ($12.9bn) in the construction of a semiconductor packaging facility in Cheongju, North Chungcheong Province, South Korea.”verdict.co.uk

1 source
verdict.co.ukSK Hynix targets AI chip expansion with $12.9bn plantAnwesha PattanaikJan 13, 2026

Summarized from public sources; check the original articles before acting on it.

More from SK Hynix

Nov 4, 2026INVESTMENTNew York, United States$45.0B
SK hynix's $45B New York semiconductor factory plan faces uncertainty
SK Hynix investor Solidigm partner businesskorea.co.kr
Nov 4, 2026REGULATIONMarcy, New York, United States$45.0B
U.S. delays export approval for SK Hynix semiconductor equipment for China factory
SK Hynix Solidigm ajupress.com
Nov 3, 2026EXPANSIONDalian, China, China
US holds up equipment licences for SK Hynix's Dalian expansion
SK Hynix Solidigm partner aiaffairs.com
Apr 22, 2026NEW FACILITYSouth Korea, South Korea$12.8B
SK Hynix to invest $12.85B in new advanced packaging plant in South Korea
SK Hynix english.aawsat.com
Mar 13, 2026CONTRACTSouth Korea$33.0M
TES wins $33 million semiconductor equipment order from SK Hynix
TES Group SK Hynix customer thelec.net
Mar 10, 2026PARTNERSHIPSilicon Valley, California, United States
Applied Materials and SK hynix form R&D partnership at EPIC Center
SK Hynix partner Applied Materials partner barchart.com

Similar announcements

Nov 5, 2026NEW FACILITYOnyang, Asan, South Chungcheong Province, South Korea, South Korea$975.0Mops May 2029
Samsung Electronics to build HBM packaging fab in Onyang, South Korea
Samsung Electronics mt.co.kr
Nov 4, 2026NEW FACILITYOchang, Cheongju, North Chungcheong Province, South Korea$31.6M123 jobsops Jun 2024
Greene Tweed builds $31.6M chip seal plant in Ochang, South Korea
Greene Tweed eastasiabrief.com
Nov 4, 2026NEW FACILITYGiheung, South Korea, South Korea$18.7B
Samsung Electronics plans $18.7B advanced foundry fab in Giheung
Samsung Electronics Samsung E&A partner eastasiabrief.com
Nov 2, 2026NEW FACILITYDaegu National Industrial Complex, Dalseong-gun, Daegu, South Korea$374.0M
Isupetasys to build 7th factory in Daegu with W500B investment
Isupetasys biz.heraldcorp.com
Jul 3, 2026NEW FACILITYGumi, North Gyeongsang Province, South Korea, South Korea400 jobsops 2029
Jagwa Electronics to build $500B won camera actuator plant in Gumi, South Korea
Jagwa Electronics mk.co.kr
Jun 29, 2026NEW FACILITYSouth Korea southwest region, South Korea$517.9B
Samsung and SK Hynix to each build two chip fabs in South Korea's southwest
Samsung Electronics SK Hynix streetinsider.com