Samsung Electro-Mechanics signs MOU with Sumitomo Chemical to form JV for glass core substrates

Samsung Electro-Mechanics signed an MOU with Sumitomo Chemical Group to establish a joint venture for manufacturing 'Glass Core', a key material for next-generation semiconductor package substrates. Samsung will be the majority investor, with the JV headquarters at Dongwoo Fine-Chem's Pyeongtaek site.

“Through this MOU, Samsung Electro-Mechanics, Sumitomo Chemical, and Dongwoo Fine-Chem will leverage their respective technological strengths and global networks to establish manufacturing and supply capabilities for 'Glass Core' and accelerate market expansion.”m.samsungsem.com

• 3 sources
• m.samsungsem.comSamsung Electro-Mechanics Signs MOU with Sumitomo Chemical Group to Establish a Joint Venture for ‘Glass Core’ Used in Package Substrates | News | Newsroom | SAMSUNG ELECTRO-MECHANICSNov 5, 2025
• ajupress.comSouth Korean, Japanese firms consider joint venture for next-generation chip materials | Aju PressKim Da-kyungNov 5, 2025
• barchart.comSamsung Electro-Mechanics Signs MOU with Sumitomo Chemical Group to Establish a Joint Venture for 'Glass Core' Used in Package SubstratesPR NewswireNov 5, 2025

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