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Hong Kong Science and Technology Parks Corporation (HKSTP) and J2 Semiconductor (Shanghai) Co. Ltd. signed an MoU to establish Hong Kong's first Silicon Carbide (SiC) 8-inch advanced wafer fab and a global R&D centre. Total investment is estimated at HK$6.9 billion, with volume production planned in a couple of years and annual capacity projected at 240,000 wafers by 2028.