HKSTP and J2 Semiconductor sign MoU for SiC wafer fab in Hong Kong

Hong Kong Science and Technology Parks Corporation (HKSTP) and J2 Semiconductor (Shanghai) Co. Ltd. signed an MoU to establish Hong Kong's first Silicon Carbide (SiC) 8-inch advanced wafer fab and a global R&D centre. Total investment is estimated at HK$6.9 billion, with volume production planned in a couple of years and annual capacity projected at 240,000 wafers by 2028.

“Total investment estimated to be HK$6.9 billion.”hkstp.org

• 1 source
• hkstp.orgHKSTP and J2 Semiconductor MoU to Enhance Microelectronics Industry | HKSTPOct 13, 2023

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