Loading…
Yield Engineering Systems (YES) received a volume purchase order for its VertaCure XP systems from a Tier 1 Taiwanese OSAT. The systems will be used for gold bumping and wafer-level packaging in high volume manufacturing, with delivery within 6 months.
Yield Engineering Systems, Inc. (YES) acquired Semiconductor Process Equipment Corp. (SPEC) of Valencia, California. SPEC adds wet processing equipment (cleaning, etching, stripping, plating) to YES's portfolio for semiconductor applications.
Yield Engineering Systems (YES) received a volume purchase order for VertaCure XP systems from Powertech Technology Inc. (PTI) for flip chip and wafer-level packaging. The systems will be delivered in the first half of 2021.