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Mitsubishi Electric is investing 20 billion yen ($187 million) to acquire facilities and land from Sharp Fukuyama Semiconductor in Hiroshima Prefecture, Japan. The site will process wafers for power semiconductors, with production expected to begin in November 2021.
Mitsubishi Electric Corporation will acquire buildings and land from Sharp Fukuyama Semiconductor Co., Ltd. in Fukuyama, Hiroshima Prefecture, Japan, to establish a new site for power semiconductor wafer processing. Production is scheduled to start in November 2021.