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ENDATA · Copyright (c) 2026 Endata · Data: CEPII BACI (Etalab 2.0), Federal Reserve G.17, U.S. BLS, Eurostat, World Bank (CC BY 4.0), GLEIF, SEC EDGAR; announcements summarized from the linked sourcesProspects Companies Sectors Announcements Countries

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INDUSTRIAL MARKET INTELLIGENCE

INDUSTRIAL MACHINERY273.5▲ +4.87%AUTOMATION AND ROBOTICS348.5▲ +10.05%PUMPS AND VALVES401.5▲ +2.64%MATERIAL HANDLING340.7▲ +3.73%FOOD PROCESSING EQUIPMENT394.8▲ +4.07%STEEL AND METAL PRODUCTS344.9▲ +29.04%SPECIALTY CHEMICALS256.3▲ +5.14%PLASTICS AND POLYMERS327.5▲ +5.94%PACKAGING506.1▲ +8.86%INDUSTRIAL TEXTILES185.9▲ +3.45%ELECTRICAL EQUIPMENT256.3▲ +8.77%SEMICONDUCTORS AND INDUSTRIAL ELECTRONICS75.3▲ +26.02%AUTOMOTIVE COMPONENTS134.7▲ +3.13%AEROSPACE COMPONENTS291.0▲ +2.38%MEDICAL DEVICES146.2▲ +4.99%CONSTRUCTION MATERIALS262.9▲ +4.08%HVAC AND INDUSTRIAL REFRIGERATION243.3▲ +5.55%POWER GENERATION EQUIPMENT289.6▲ +3.63%WATER TREATMENT EQUIPMENT152.1▲ +2.68%MINING EQUIPMENT462.3▲ +3.56%INDUSTRIAL MACHINERY273.5▲ +4.87%AUTOMATION AND ROBOTICS348.5▲ +10.05%PUMPS AND VALVES401.5▲ +2.64%MATERIAL HANDLING340.7▲ +3.73%FOOD PROCESSING EQUIPMENT394.8▲ +4.07%STEEL AND METAL PRODUCTS344.9▲ +29.04%SPECIALTY CHEMICALS256.3▲ +5.14%PLASTICS AND POLYMERS327.5▲ +5.94%PACKAGING506.1▲ +8.86%INDUSTRIAL TEXTILES185.9▲ +3.45%ELECTRICAL EQUIPMENT256.3▲ +8.77%SEMICONDUCTORS AND INDUSTRIAL ELECTRONICS75.3▲ +26.02%AUTOMOTIVE COMPONENTS134.7▲ +3.13%AEROSPACE COMPONENTS291.0▲ +2.38%MEDICAL DEVICES146.2▲ +4.99%CONSTRUCTION MATERIALS262.9▲ +4.08%HVAC AND INDUSTRIAL REFRIGERATION243.3▲ +5.55%POWER GENERATION EQUIPMENT289.6▲ +3.63%WATER TREATMENT EQUIPMENT152.1▲ +2.68%MINING EQUIPMENT462.3▲ +3.56%

HD MicroSystems: plants, expansions, contracts and acquisitions · Endata

HD MicroSystems

Activity by year

1

20192020202120222023202420252026

Partnership

Announcements · 1

Feb 15, 2019PARTNERSHIPBoise, Idaho, United States
HD MicroSystems and American Semiconductor establish joint development agreement for ultra-thin chip packaging
HD MicroSystems (HDM) and American Semiconductor (ASI) announced a joint development agreement to drive adoption of ultra-thin chip packaging technology for rigid and flexible electronics markets, leveraging ASI's wafer-level chip scale packaging and HDM's polyimide materials.
HD MicroSystems partner American Semiconductor partner #Semiconductors and Industrial Electronics americansemi.com

Dealingsⓘ

Partners

American Semiconductor2019