HD MicroSystems and American Semiconductor establish joint development agreement for ultra-thin chip packaging

HD MicroSystems (HDM) and American Semiconductor (ASI) announced a joint development agreement to drive adoption of ultra-thin chip packaging technology for rigid and flexible electronics markets, leveraging ASI's wafer-level chip scale packaging and HDM's polyimide materials.

“HD MicroSystemsTM (HDM) and American Semiconductor, Inc. (ASI) today announced the establishment of a joint development agreement to drive the adoption of ultra-thin chip packaging technology for both traditional rigid and emerging flexible electronics markets.”americansemi.com

• 1 source
• americansemi.comHDM and ASI Announce JDA To Produce the World’s First High Reliability Ultra-Thin Packaged ICs - American Semiconductor (ASI)American SemiconductorFeb 15, 2019

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