Alpha and Omega Semiconductor

Alpha and Omega Semiconductor sold approximately 2.1% of its equity interest in its Chongqing joint venture to a third party for RMB 108 million ($16.9 million), reducing its ownership to 48.8% and deconsolidating the JV from its financial statements.

Alpha and Omega Semiconductor's joint venture, Chongqing WanGuo Semiconductor Technology Co., Ltd., is expected to start formal production in October 2018 at its 12-inch power semiconductor wafer fab and packaging/testing facility in Chongqing, China. The total investment is $1 billion.

Chongqing AOS Semiconductor's 12-inch power semiconductor chip manufacturing and packaging/testing base project in Liangjiang New Area, Chongqing, entered trial production. The total investment is $1 billion, with phase 1 at $500 million, targeting 20,000 wafers per month and 500 million chips packaged/tested per month.

Chongqing Alpha and Omega Semiconductor, a joint venture, will begin trial production at its 12-inch power semiconductor chip manufacturing and packaging testing facility in Liangjiang New Area, Chongqing, in March 2018. The total investment is $1 billion.

Alpha and Omega Semiconductor's joint venture subsidiary signed an EPC contract with The IT Electronics Eleventh Design & Research Institute for the construction of a power semiconductor packaging/testing and wafer fabrication facility in Liangjiang New Area, Chongqing, China.

Wuxi Taiji Industry's subsidiary, the Eleventh Design & Research Institute (EDRI), signed a 540 million yuan EPC contract with Chongqing Vanguard Semiconductor for a 12-inch power semiconductor chip manufacturing and packaging/testing base project in Chongqing, China. The project is expected to be completed by January 15, 2018.