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Foxconn's packaging subsidiary Foxsem plans to invest $80 million to expand chip manufacturing capacity at its Bắc Giang facility in Vietnam. The expansion will focus on Co-Packaged Optics (CPO) components, with full-scale mass production expected by December 2026 and annual capacity reaching 4.5 million units.
“Foxconn's packaging subsidiary, Foxsem, is set to invest $80 million to increase its chip manufacturing capacity in Vietnam.”ic-online.com
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