Amkor signs preliminary terms with US Commerce for $2B Arizona packaging facility

Amkor Technology signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive up to $400 million in direct funding and $200 million in loans under the CHIPS Act for its planned advanced packaging and test facility in Peoria, Arizona. Amkor projects to invest approximately $2 billion and employ about 2,000 people.

“Amkor announced today it has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act.”ir.amkor.com

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• ir.amkor.comAmkor Signs Preliminary Memorandum of Terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility | Amkor TechnologyJul 26, 2024

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