DOD awards $49 million for advanced semiconductor packaging

The U.S. Department of Defense awarded two contracts totaling $49 million to Micross Components and the government of Osceola County, Florida, to revitalize advanced packaging capabilities for semiconductors used in defense applications.

“The Department of Defense announced today the award of two contracts totaling $49 million to revitalize advanced packaging capabilities and capacity for semiconductors used in defense applications.”war.gov

• 1 source
• war.govDOD Awards $49 Million to Improve Advanced Semiconductor Packaging Capabilities > U.S. Department of War > Release | U.S. Department of WarJan 24, 2024

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