Micross Components receives $134.3M DoD contract for advanced packaging

Micross Components received a $134.3 million award under the IBAS Cornerstone RESHAPE program from the U.S. Department of Defense to develop advanced packaging capabilities for secure microelectronics. The award includes $45.6 million obligated at the time of the award and will add 300mm wafer processing capabilities and expand 200mm wafer production capacity at its Raleigh, NC facility.

“The Defense Industrial Base will benefit from the RESHAPE on-shoring effort to further Advanced Packaging manufacturing capabilities with Micross Components.”prnewswire.com

• 1 source
• prnewswire.com$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the USMicross ComponentsNov 27, 2023

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