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ENDATA · Copyright (c) 2026 Endata · Data: CEPII BACI (Etalab 2.0), Federal Reserve G.17, U.S. BLS, Eurostat, World Bank (CC BY 4.0), GLEIF, SEC EDGAR; announcements summarized from the linked sourcesProspects Companies Sectors Announcements Countries

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INDUSTRIAL MACHINERY273.5▲ +4.87%AUTOMATION AND ROBOTICS348.5▲ +10.05%PUMPS AND VALVES401.5▲ +2.64%MATERIAL HANDLING340.7▲ +3.73%FOOD PROCESSING EQUIPMENT394.8▲ +4.07%STEEL AND METAL PRODUCTS344.9▲ +29.04%SPECIALTY CHEMICALS256.3▲ +5.14%PLASTICS AND POLYMERS327.5▲ +5.94%PACKAGING506.1▲ +8.86%INDUSTRIAL TEXTILES185.9▲ +3.45%ELECTRICAL EQUIPMENT256.3▲ +8.77%SEMICONDUCTORS AND INDUSTRIAL ELECTRONICS75.3▲ +26.02%AUTOMOTIVE COMPONENTS134.7▲ +3.13%AEROSPACE COMPONENTS291.0▲ +2.38%MEDICAL DEVICES146.2▲ +4.99%CONSTRUCTION MATERIALS262.9▲ +4.08%HVAC AND INDUSTRIAL REFRIGERATION243.3▲ +5.55%POWER GENERATION EQUIPMENT289.6▲ +3.63%WATER TREATMENT EQUIPMENT152.1▲ +2.68%MINING EQUIPMENT462.3▲ +3.56%INDUSTRIAL MACHINERY273.5▲ +4.87%AUTOMATION AND ROBOTICS348.5▲ +10.05%PUMPS AND VALVES401.5▲ +2.64%MATERIAL HANDLING340.7▲ +3.73%FOOD PROCESSING EQUIPMENT394.8▲ +4.07%STEEL AND METAL PRODUCTS344.9▲ +29.04%SPECIALTY CHEMICALS256.3▲ +5.14%PLASTICS AND POLYMERS327.5▲ +5.94%PACKAGING506.1▲ +8.86%INDUSTRIAL TEXTILES185.9▲ +3.45%ELECTRICAL EQUIPMENT256.3▲ +8.77%SEMICONDUCTORS AND INDUSTRIAL ELECTRONICS75.3▲ +26.02%AUTOMOTIVE COMPONENTS134.7▲ +3.13%AEROSPACE COMPONENTS291.0▲ +2.38%MEDICAL DEVICES146.2▲ +4.99%CONSTRUCTION MATERIALS262.9▲ +4.08%HVAC AND INDUSTRIAL REFRIGERATION243.3▲ +5.55%POWER GENERATION EQUIPMENT289.6▲ +3.63%WATER TREATMENT EQUIPMENT152.1▲ +2.68%MINING EQUIPMENT462.3▲ +3.56%

TOPPAN acquires JOLED's Nomi plant for semiconductor packaging · Endata

◂ Announcements

Dec 5, 2023ACQUISITIONNomi, Ishikawa, Japan

TOPPAN acquires JOLED's Nomi plant for semiconductor packaging

TOPPAN has acquired the Nomi plant of bankrupt JOLED in Ishikawa, Japan, to build next-generation semiconductor packaging (FC-BGA) development and mass production lines, targeting operations from 2027.

Status

Announced

ProductsFC-BGA semiconductor packages

CompaniesToppan acquirer JOLED target

Sectors#Semiconductors and Industrial Electronics

“TOPPANは、次世代半導体パッケージの開発／量産ラインを構築する予定で、2027年以降の稼働を目指す。”eetimes.itmedia.co.jp

1 source
eetimes.itmedia.co.jpTOPPANがJOLEDの工場を買収、次世代半導体パッケージ開発／量産へ：FC-BGAの生産能力を増強 - EE Times JapanDec 6, 2023

Summarized from public sources; check the original articles before acting on it.

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