Texas Instruments breaks ground on $11B semiconductor fab in Lehi, Utah
Texas Instruments broke ground on LFAB2, a new 300-mm semiconductor wafer fabrication plant in Lehi, Utah. The $11 billion investment is expected to create 800 jobs, with first production as early as 2026.
Capacity
tens of millions of analog and embedded processing chips per day at full production
Productsanalog and embedded processing semiconductors
“Today we take an important step in our company's journey to expand our manufacturing footprint in Utah.”ti.com
- 2 sources
- ti.comTexas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plant in Utah | TI.comNov 2, 2023
- investor.ti.comInvestor relations - Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plant in Utah - Texas InstrumentsNov 2, 2023
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