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Dexin Chip Technology Co., Ltd. held a groundbreaking ceremony for a high-power device wafer R&D and production base in Suzhou Industrial Park. The project has a total investment of 5 billion yuan, with phase I fixed investment of 1.4 billion yuan, planning a 6-inch production line with a capacity of 70,000 wafers per month.
“德信芯片将在苏州工业园区建设高端功率器件晶圆研发生产基地,预计总投资50亿元,研发生产高端功率器件。”zgjssw.gov.cn
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