CanSemi starts third-phase expansion at 12-inch fab in Guangzhou

CanSemi Technology has kicked off its third-phase expansion at its 12-inch wafer fab in Guangzhou, China, with total investment of CNY 16.25 billion (US$2.355 billion). The expansion will add 40,000 wafers per month capacity, reaching 120,000 by 2025, with processes advancing to 55-40nm and 22nm.

“CanSemi's third-phase capacity will be mainly for producing power electronics, server chips, power devices for 5G infrastructure and automotive applications.”digitimes.com

• 1 source
• digitimes.comCanSemi starts capacity expansion for analog chips at 12-inch fabStaff reporter, Taipei; Willis Ke, DIGITIMES AsiaSep 1, 2022

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