NHanced Semiconductors expands North Carolina foundry with high-volume advanced packaging line

NHanced Semiconductors is expanding the cleanroom of its North Carolina foundry to house a new high-volume advanced packaging line. The new line is expected to begin production in the second half of 2022, capable of producing up to 10,000 3DIC wafer stacks per month.

“The new line is expected to begin production in the second half of 2022, capable of constructing up to 10,000 3DIC wafer stacks per month.”businesswire.com

• 1 source
• businesswire.comDedicated High‑Volume Advanced Packaging Facility, First in US, Announced by NHanced SemiconductorsGretchen PattiJun 15, 2021

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