DeviceENG signs 6.1 billion won semiconductor equipment deal with Samsung Electronics

DeviceENG (디바이스이엔지) has signed a contract with Samsung Electronics to supply semiconductor manufacturing equipment worth 6.09 billion won. The contract runs until July 30, 2021.

“디바이스이엔지는 삼성전자와 반도체 제조장비 공급계약을 체결했다고 14일 공시했다.”biz.heraldcorp.com

• 1 source
• biz.heraldcorp.com디바이스이엔지, 삼성전자와 61억 규모 반도체 제조장비 공급계약 - 헤럴드경제이지윤2Apr 14, 2021

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