Power Semiconductor breaks ground on 12-inch wafer fab in Tongluo, Taiwan

Power Semiconductor Manufacturing Co., Ltd. held a groundbreaking ceremony for its 12-inch wafer fab in Tongluo, Taiwan. The total investment is 63.6 billion yuan, with production expected to start in phases in 2023 and a monthly capacity of 100,000 wafers.

“On March 25th, chip foundry company Power Semiconductor Manufacturing Co., Ltd. held a groundbreaking ceremony for its 12-inch fab in Tongluo, Taiwan, China.”power-ic.cn

• 1 source
• power-ic.cnInvest 63.6 billion yuan to start construction of Power Semiconductor’s 12-inch wafer fab_上s海市浦东新区瑞庆路528号24幢乙号Mar 26, 2021

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