Samsung enters equipment installation phase for phase-2 NAND flash plant in Xi'an

Samsung China Semiconductor's 12-inch NAND flash memory chip phase II project in Xi'an, China, entered equipment installation phase on March 11, 2021. Completion and operation are expected by mid-2021, with output reaching 130,000 wafers per month.

“The 12-inch NAND flash memory chip phase II project of Samsung China Semiconductor Co in Xi'an, Northwest China's Shaanxi Province, entered equipment installation phase on Thursday.”globaltimes.cn

• 1 source
• globaltimes.cnSamsung constructs phase-2 memory chip base in Xi'an, northwest China - Global TimesGlobal TimesMar 11, 2021

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