Wingtech starts construction of 12-inch automotive power semiconductor wafer plant in Shanghai

Wingtech Technology began construction of a 12-inch automotive-grade power semiconductor wafer manufacturing project in the Lingang Special Area of Shanghai. The project involves a total investment of CNY 12 billion and is expected to produce 400,000 wafers annually.

“闻泰科技'12英寸车规级功率半导体晶圆制造项目'4日在中国(上海)自由贸易试验区临港新片区开工。”chinanews.com.cn

• 1 source
• chinanews.com.cn中国首个“12英寸车规级功率半导体晶圆制造项目”在沪开工-中新网Jan 4, 2021

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