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Daeduck Electronics has expanded mass production of flip-chip ball grid array (FC-BGA) substrates for non-memory semiconductors since October 2020. The company plans to build a new FC-BGA plant in Ansan, South Korea, with a 90 billion won investment, starting operations in the second half of 2021.
“FC-BGA 신 공장은 내년 하반기 본격 가동 예정입니다.”thelec.kr
Summarized from public sources; check the original articles before acting on it.