Jiangsu Renqi to build chip industrial park in Siyang, Jiangsu

Jiangsu Renqi Technology plans to build a chip industrial park in Siyang Economic Development Zone, with annual capacity of 600,000 6-inch wafers and 1 billion chip packages/tests. The EPC contract with 11th Design & Research Institute is valued at CNY 1.0886 billion.

“江苏仁奇科技有限公司芯片产业园区投资建设项目拟利用2年时间，在泗阳经济开发区建成一个涵盖芯片制造、封测、研发的产业化基地，形成年产6英寸0.25um芯片线60万片，年封测10亿颗的生产能力。”casmita.com

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• casmita.com重磅！江苏仁奇将新建化合物晶圆产线：年产6寸线60万片，年封测10亿颗_产业_新闻资讯_半导体产业网Jun 17, 2020

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