Foxconn to build semiconductor packaging plant in Qingdao

Foxconn Technology Group plans to build a new semiconductor packaging and testing factory in Qingdao, China, focusing on chips for 5G and AI hardware. Construction is set to start in 2020.

“The new facility, which will start construction this year, will focus on the packaging and testing of application-specific integrated circuits used in 5G communications and artificial intelligence (AI) hardware products.”scmp.com

• 4 sources
• scmp.comApple supplier Foxconn steps up semiconductor plans with deal to build a new base in Qingdao | South China Morning PostJane ZhangApr 17, 2020
• globaltimes.cnDomestic manufacturers give chips more weight, refuse to await doom - Global TimesGlobal TimesApr 21, 2020
• globaltimes.cnDomestic manufacturers give chips more weight, refuse to await doom - Global TimesGlobal TimesApr 21, 2020
• govt.chinadaily.com.cnFoxconn semiconductor project to land in Qingdao | govt.chinadaily.com.cnApr 24, 2020

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