Guangxi Tianwei chip project officially settles in Hezhou

The Guangxi Tianwei chip project, with a total investment of 500 million RMB, has officially settled in Hezhou. Phase 1 invested 100 million RMB and is expected to start production by the end of December 2019.

“广西天微芯片项目总投资5亿元，分二期完成，一期项目计划投资1亿元，并于2019月7月开工建设，目前已完成厂房装修，223台(套)设备正在安装调试，预计2019年12月底可正式投产。”semiunion.com

• 1 source
• semiunion.com总投资5亿人民币、12月底投产，广西天微芯片项目正式落户贺州-产业园区-半导体联盟semiunionDec 18, 2019

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