Dagang Co. subsidiary to expand CIS chip wafer-level packaging capacity

Dagang Co.'s subsidiary Suzhou Keyang plans to invest 130 million yuan to add equipment to its existing production line to expand 8-inch CIS chip wafer-level packaging capacity. The expansion will be implemented in two phases, with the first phase adding 3,000 wafers per month.

“公司子公司苏州科阳拟使用自筹资金在原有产线上增加设备的方式扩充8吋CIS芯片晶圆级封装产能，预计总投资1.3亿元，产能扩充分两期实施，其中首期新增产能3000片/月。”cs.com.cn

• 1 source
• cs.com.cn大港股份：扩充CIS芯片晶圆级封装产能_中证网Dec 11, 2019

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