Winpac completes investment in flip chip and PoP production facilities

Winpac completed a 50 billion won investment in new factory and equipment in Yongin, South Korea, for flip chip and package-on-package semiconductor packaging, and began mass production.

“반도체 후공정 전문업체 윈팩이 플립칩(FliP chip)과 패키지 온 패키지(POP) 생산시설 투자를 완료하고 본격 양산에 들어간다고 28일 밝혔다.”etoday.co.kr

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• etoday.co.kr윈팩, 생산시설 투자 완료...소형화·경량화 반도체용 플립칩 및 POP 양산 - 이투데이Oct 28, 2019

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