Unimicron to invest NT$20 billion in IC substrate plant expansion

Unimicron (欣興) announced a plan to invest approximately NT$20 billion from 2019 to 2022 to expand its high-end IC flip-chip substrate plant, targeting 5G, AI, and data center technologies.

“希望經由技術與商業併進的方式，與世界級公司協同合作，發展5G、AI和大數據中心時代所需的高階先進IC覆晶載板利基技術，提升公司競爭力。”cna.com.tw

• 1 source
• cna.com.tw欣興擴增IC覆晶載板廠 4年擬投資200億 | 證券 | 中央社 CNA中央通訊社May 9, 2019

Summarized from public sources; check the original articles before acting on it.