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STMicroelectronics and Leti announced a cooperation to develop and industrialize GaN-on-Silicon power switching devices on 200mm wafers, with a pilot line at ST's Tours fab expected operational by 2020.
“Recognizing the incredible value of wide-bandgap semiconductors, ST's contributions in Power GaN-on-Si manufacturing and packaging technologies with CEA-Leti move to arm us with the industry's most complete portfolio of GaN and SiC products and capabilities.”globenewswire.com
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