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Unisem (M) Bhd proposed a private placement to raise up to RM399.9 million to fund expansion of its semiconductor assembly and test facility in Ipoh, Malaysia, and construction of a new production facility in Chengdu, China.
“The group has plans to improve the production capacity of its semiconductor assembly and test facility and the wafer bumping facility in Ipoh.”theedgemalaysia.com
Summarized from public sources; check the original articles before acting on it.