UNT plans CNY 20B Phase IV wafer fab in Shaoxing for automotive mixed-signal chips

United Nova Technology (UNT) announced plans to invest approximately CNY 20 billion in a Phase IV 12-inch automotive-grade mixed-signal semiconductor manufacturing facility in Shaoxing, with UNT contributing CNY 3.012 billion. The facility will have a monthly capacity of 50,000 wafers, focusing on 40nm-28nm MCU/DSP and 90nm-55nm analog devices, including silicon photonics chips.

“The investment will help the company capitalize on emerging opportunities in AI servers and optical interconnect applications.”trendforce.com

• 1 source
• trendforce.com[News] UNT Unveiled Plans to Expand Wafer Production with CNY 3B, Partly for Optical Interconnect ApplicationsJun 24, 2026

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